Rumah ProdukPCB Copper Foil

High density Single Shiny Treated RA Cu Foil For PCB , Fine Circuit FPC

High density Single Shiny Treated RA Cu Foil For PCB , Fine Circuit FPC

    • High density Single Shiny Treated  RA Cu Foil For PCB , Fine Circuit FPC
    • High density Single Shiny Treated  RA Cu Foil For PCB , Fine Circuit FPC
  • High density Single Shiny Treated  RA Cu Foil For PCB , Fine Circuit FPC

    Detail produk:

    Place of Origin: SHANGHAI,CHINA
    Nama merek: Civen
    Sertifikasi: ISO/ROHS/CTI/SGS

    Syarat-syarat pembayaran & pengiriman:

    Minimum Order Quantity: 1000kg
    Harga: Negotiation
    Packaging Details: Packed in strong wooden case suit for exporting
    Delivery Time: 10~15 working days after receiving your deposit
    Payment Terms: L/C, T/T
    Supply Ability: 550MT Per Month
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    Detil Deskripsi produk
    Product Name: Single Shiny Treated RA Cu Foil For PCB With Maximum Width 650mm In Roll Alloy Number: C11000
    Material: Red Copper Shape: Roll
    Density: 8.9g/cm3 Width(Max): 600mm
    Thickness: 12μm~100μm Application: PCB

    Single Shiny Treated  RA Cu Foil For PCB With Maximum Width 650mm In Roll

     

     

    Dimension Range:

     

    Copper Foil thickness from 12~100µm can be supplied for FPC.

    Width can be made according to clients’ requirement up to 600mm.

     

    Performances:

     

    High flexibility and extensibility

    Even and smooth surface

    Good fatigue resistance

    Strong antioxidant properties

    Good mechanical properties

     

    Applications:

     

    Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.

    Features:

    The material has higher extensibility, and has a high bending resistance and no crack.

     

    Table 1:FPC T2 high flex rolled copper foil properties (IPC-6542)

     

    Item

    Unit

    Parameters

    12μm

    18μm

    25μm

    35μm

    70μm

    Mass per unit(±5%)

    g/m²

    105

    160

    300

    400

    445

    Cu+Ag

    %

    ≥99.99

    Temper

     

    H

    O,H

    O,H

    O,H

    O,H

    Surface roughness

    Ra

    μm

      0.13              

    0.12

    0.1

    0.08

     0.08

    Rz

    μm

    1.3

    1.0

    0.8

    0.74

    0.76

    Tensile strength

    Normal Temp /23℃

    N/mm²

    ≥430

    ≥450

    ≥450

    ≥450

    ≥450

    High Temp /220℃

    N/mm²

    ≥140

    ≥150

    ≥170

    ≥210

    ≥220

    Elongation

    Normal Temp /23℃

    %

    ≥1.5

    ≥3.0

    ≥4.0

    ≥4.2

    ≥4.5

    High Temp /220℃

    %

    ≥8

    ≥10

    ≥18

    ≥28

    ≥30

    Fatigue Resistance (annealed)

    %

    65

    65

    65

    65

    65

    Maximum resistivity

    Ωmm2/m

    0.0181

    Electrical conductivity

    %

    ≥98.3%

    Film and adhesive layers

    Instant Temp. 

    300℃/10s

    Film and adhesive paste after transient 

    temperature without blistering delamination.

    Anti oxidation 

    H.T.(200℃)

    Minute

    Won’t Change the Color within 60 minutes

    Pinhole test results

    piece/ m²

    Pinhole area more than 0.5 mm²,0.005 piece/ m²

    Note: 1. Above figures based on the material with 0.05mm in thickness and 600mm in width.

         2. Normally, Copper, cobalt and nickel is coated on the rough surface.

         3. Testing method follows our company standard.

     

    Application

     

    High density Single Shiny Treated  RA Cu Foil For PCB , Fine Circuit FPC

    Rincian kontak
    Civen Metal Material(Shanghai) Co.,Ltd

    Kontak Person: Mr. Duearwin Moon

    Mengirimkan permintaan Anda secara langsung kepada kami (0 / 3000)

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